The alloy has a linear expansion coefficient similar to that of silicon boron hard glass at 20 to 450°C, a higher Curie point, and good low-temperature microstructure stability. The oxide film of the alloy is dense and can be well infiltrated by the glass. It does not interact with mercury and is suitable for use in mercury-containing discharge meters. The electrical vacuum device is mainly sealed with structural materials.

 

Application field：

lMain structural materials of electric vacuum devices

lIntegrated circuit housing, bracket

lCrystal connector

 

 

 

 

Physical properties

Density: 8.35g/cm3

Specific surface area: 0.22cm2/g

Sphericity ≥98.5%

Bulk density: 4.15g/cm3

Hall flow rate: 17.2s/50g

Melting point: 1420-1490℃

Relative density: close to 100%

Recommended layer thickness: 15μm, 20μm, 30μm, 40μm, 50μm,

 

Technical standard: "Technical Specification for 4J29 Powder for 3D Printing"

Note: If the alloy powder has moisture absorption, or the storage period exceeds 3 months, it should be used before

Carry out drying treatment (150℃, heat preservation for 2 hours)